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Dear Friends,
We all hope that the corona virus will get under control and we get back to a normal life.
The extremely great feedback from our traditional WBG Conference in Munich will continue. We have started planning together with AspenCore the event for the 14th -15th of December 2020.
The next highlight for WBG devices will be at PCIM. My podiums discussion takes place in Hall 7-549 on Wednesday the 6th of May in Nuremberg. The session will start at 13:30 to 15:30, first SIC followed by GaN.
Do not miss our Chinese version bodospowerchina.com. There is no better way to communicate. As a publisher I serve the world: one magazine, on time, every time.
Best Regards,
Bodo Arlt editor@bodospower.com
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| e-Newsletter Content - just click and get to your topic: |
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The News
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- The World of Power Semiconductor Devices Meets in Vienna
- Supervisory Board with New Line-Up
- PCIM Europe 2020's Trending Topics and Highlights
- "Not Knowing the Rules Can Ruin Your Power Converter Design"
- Shining the Spotlight on Intelligent Charging Systems
- Iso 13485:2016 Certification Achieved
- Battery Electric Vehicle Architectures Congress
- Expert to Present at EPP InnovationsFORUM Germany
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Preview of Content in the March Issue
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- Viewpoint
- Product of the Month
- Blue Product of the Month
- Green Product of the Month
- Cover Story
- VIP Interview
- Wide Band Gap
- Power Management
- DC/DC Converter
- Intelligent Power
- Wide Band Gap
- Design and Simulation
- Opto
- Packaging
- Magnetic Components
- Power Supply
- Design and Simulation
- Power Management
- Magnetic Components
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Events
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New Products
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- E Cores Solve Challenging Power Conversion Applications
- Intelligent Power Devices Enabling Standalone System Protection
- Low RDS(on) MOSFET
- AC/DC Modules Meet ecodesign Specifications
- Source-Down 25 V Power MOSFET
- Jetting Solder Paste
- 24V Industrial Power Supply
- Programmable DC Load Product Series
- Fuses Designed for Automotive and In-Rush Current Applications
- Integrated Active Clamp Flyback Controllers
- Wide Bandgap Power Amplifier
- Relay with Power Contacts on NO and NC Side
- High Voltage Molded Power Inductors
- SMD Fuse Family Extended
- Quarter-Brick with Digital Control for Telecom and Compute Equipment
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| The News |
The World of Power Semiconductor Devices Meets in Vienna
The 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD) will be held in Vienna, Austria, May 17–21, 2020. It is the premier forum for technical discussion in all areas of power semiconductor devices, power integrated circuits, their hybrid technologies, and applications. With an attendance of about 500 experts it is firmly established as the must-attend conference for the power semiconductor industry reflecting the growing importance of power electronics and power semiconductors for a sustainable world. It is technical co-sponsored by IEEE and its societies EDS, PELS and IAS, as well as by ECPE and IEEJ.
View full press release
ispsd2020.com
Supervisory Board with New Line-Up
The terms of office of all employee representatives on the Supervisory Board and of six of the eight members on the side of the shareholders will expire at the close of the Annual General Meeting of Infineon Technology. The future employee representatives were already elected in December 2019. The remaining members are to be elected by the shareholders at the upcoming Annual General Meeting.
View full press release
infineon.com/press
PCIM Europe 2020's Trending Topics and Highlights
Every year the power electronics industry from all over the world meets at the PCIM Europe in Nuremberg. In 2020, trade visitors of the leading international exhibition and conference for power electronics can, once again, look forward to highly specialized highlight topics and an attractive program of lectures. From 5 - 7 May 2020, Nuremberg will revolve around power electronics and its applications.
View full press release
pcim.mesago.com/press
"Not Knowing the Rules Can Ruin Your Power Converter Design"
The Power Sources Manufacturers Association (PSMA) Energy Management Committee is sponsoring Industry Session IS29 at APEC2020 on Thursday, March 19th, at 1:45 pm in the Ernest N. Morial New Orleans Convention Center. Four presentations each address an "if" that can throw a wrench into a power converter design:
- "If Your Efficiency is Too Low, Your Sales will be Too Low" (Ada Cheng, Ada'Clock)
- "If Your Standby Power is Too High, Your Power Converter Won't Sell" (David Chen, Power Integrations' Director Applications Engineering)
- "If Your Power Converter is Not Safe, You May Have an Expensive Recall" (Mark Batulan, Product Safety Engineer, Power Integrations)
- "EMI: If You Don't Comply, It Will Interfere with Your Sales." (Jim Spangler, Spangler Prototype; Kevin Parmenter, Taiwan Semiconductor US)
View full press release
psma.com
Shining the Spotlight on Intelligent Charging Systems
A new white paper produced by the European business association SmartEN (Smart Energy Europe) in cooperation with Power2Drive Europe, the international exhibition for charging infrastructure and e-mobility, sheds light on the latest trends. The topic will also be a key feature of the exhibition itself, which will take place in Munich from June 17 to 19, 2020. One highlight of the event will be the introduction of new smart charging and vehicle-to-grid concepts (V2G).
View full press release
powertodrive.de/press-releases
Iso 13485:2016 Certification Achieved
EOS Power is proud to announce that it has received certification for ISO 13485:2016, Quality management system for Medical devices. The certification was granted by LL-C Certification, Czech Republic. EOS Power is engaged in design, manufacturing and selling of Medical grade power supplies. EOS Provides standard, modified and custom design power solutions to customer needs. All Medical grade power supplies are approved to latest medical certifications required globally and now in addition EOS Power design process, manufacturing and quality systems are certified to ISO13485 standards.
View full press release
eospower.com/News.pdf
Battery Electric Vehicle Architectures Congress
Optimisation in design, engineering and manufacturing are key issues for all OEMs. In order to directly address these, and identify solutions, LBCG is delighted to announce the Battery Electric Vehicle Architectures & Lightweight Materials 2020 Congress, May 5 & 6, 2020, Munich, Germany, a combination of our successful BEVA series and GALM series on BEV lightweight structures and material utilisation.
View full press release
beva-alm-europe.com
Expert to Present at EPP InnovationsFORUM Germany
Indium Corporation's Andreas Karch, Regional Technical Manager for Germany, Austria, and Switzerland, will present at the EPP InnovationsFORUM Germany on March 5 in Böblingen, Germany.
Markets for electronic devices and assemblies are currently undergoing rapid change due to ever-shorter development times in the industrial and automotive sectors. In his presentation, "Individual Electronic Products Require Innovative Solder Materials: New Solder Materials Adapted for Temperature Application Areas", Karch examines how high-performance applications, such as "multicopters" and semi-autonomous vehicles, are driving demands for new high-reliability solder alloys.
indium.com/news
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| Preview of Content in the March Issue |
Viewpoint
New Orleans and APEC
Product of the Month
An Intelligent Power Module for High Switching Frequency Applications
Blue Product of the Month
Win a Microchip Curiosity PIC32MZ EF Dev Board 2.0
Green Product of the Month
Making ADAS Technology More Accessible in Vehicles
Cover Story
Evaluate Enhancement of Full SiC 3.3 kV Power Module in nHPD2 Package
Hitachi has been at the forefront of introducing new packaging technology for high power semiconductors. Implementing the next-generation package platform, nHPD2, the product line-up of full SiC 3.3 kV modules is being expanded. By providing SiC Schottky barrier diode (SBD) co-packaged with SiC MOSFETs and full SiC chopper modules applicable circuit configurations such as 3 level converters, brake chopper circuit and boost converter can be implemented.
By Praneet Bhatnagar, Hitachi Europe & Katsuaki Saito, Hitachi Power Semiconductor Devices
VIP Interview
Materials Science Changes the World of Electronics
VIP-Interview with Andy Mackie, Senior Product Manager, Semiconductor and Advanced Assembly Materials at Indium Corp, about the company as a premier supplier of materials for a wide variety of different applications.
By Henning Wriedt, US-Correspondent Bodo’s Power Systems
Wide Band Gap
Why are Ultra-Low On-Resistance SiC FETs Hot?
So Your Systems Can Run Cool!
Power semiconductor switches are typically used in circuits where reducing losses during current conduction without aggravating switching losses is of great benefit. In various circuit protection applications where the devices must carry current continuously, lower losses in the conduction state are beneficial to keeping system efficiencies high and waste heat generation at a minimum.
By Anup Bhalla, V.P. Engineering, UnitedSiC
Power Management
Solving the Power Density Challenge
Artificial intelligence (AI), smart cities, and autonomous driving are only a couple of megatrends that impact mankind and transform our way of living. They also pose some tough challenges to current state-of-the-art technologies in many related disciplines.
By Bastian Lang, Product Marketing Manager, Dr. Roberto Rizzolatti, System Innovation Engineer and Christian Rainer, System Innovation Engineer at Infineon Technologies
DC/DC Converter
Getting the Most Out of a DC/DC Converter
Small isolated DC/DC converter modules have been used for decades to efficiently match the supply voltage requirement of a load to the available power rail, to provide low-power auxiliary voltages such as a negative rail for an analog interface, for safety isolation or just to break ground loops for a particularly sensitive area of circuitry.
By Steve Roberts, Innovations Manager, Recom and Axel Stangl, Product Sales Manager, Rutronik
Intelligent Power
Imagine a World Without Switching Losses
Until recently, the power conversion industry's progress in efficiency, size, weight and cost have been principally driven by improvements in semiconductor transistors. To achieve these improvements, the engineering goals for new transistors were straight-forward: increase the stand-off voltage, reduce conduction and switching losses, and reduce costs.
By Bruce T. Renouard, Pre-Switch
Wide Band Gap
Design Considerations for a GaN-Based High Frequency LLC Resonant Converter
This article evaluates the performance of Gallium Nitride (GaN) power transistors in comparison to Silicon Superjunction MOSFETs (Si SJMOS) and Silicon Carbide MOSFETs (SiC MOS) for the high frequency LLC resonant topology. It first introduces key transistor insights for achieving a high efficiency and high power density LLC resonant converter.
By Jimmy Liu, GaN Systems Inc, Canada
Design and Simulation
The Power of Dowell's Equations and Curves
The standardized curves of Dowell's equations are a superb tool for designing better high-frequency magnetics. It is not sufficient to simply use a wire or foil of one skin depth or less. Excessive losses can continue at high frequencies. A careful balance of layer count and wire or foil count is needed to reach an optimum design. Using the numerical curves, instead of the original equations, provides a shortcut path to better understanding of winding design.
By Dr. Ray Ridley, Ridley Engineering Inc.
Opto
Internal Faraday Shield and Small Ci-o Enhance Optocoupler Galvanic Isolation Performance
High voltage isolation in today's context involves integrating subsystems with large voltage differences and systems ground potentials. This enables isolation applications ranging from power supply, motor control circuit of servo automation systems and industrial robots, battery management systems, photovoltaic (PV) inverters, electric vehicle (eV) inverters, ultra-fast charging and wireless charging stations to data communication and digital logic interface circuits.
By Lim Shiun Pin, Technical Marketing Engineer, Isolation Products Division, Broadcom Incorporated
Packaging
Improving Vacuum Solder Reflow for Challenging Power Module Packaging
The Power Module Packaging Market is projected by some analysts to have a CAGR of nearly 10% from 2019 through 2025, driven by the competing demands for more global energy consumption and the push to reduce the impact of fossil fuels on our environment. Sustainable energy and savings through improved efficiencies will drive improvements in the chip and packaging technologies used in power electronics.
By Matt Vorona, SST Vacuum Reflow Systems, a Palomar Technologies Solution
Magnetic Components
Proper Validation of Output Choke: Same Shaped Ferrite vs. Dust Core
Output chokes for Switched Mode Power Supplies (SMPSs) normally operate for a DC load, where a bias magnetic field (HDC) is generated under operation of the magnetic cores. For the emerging mega-watt applications with SiC power devices, the proper validation of output chokes is of great challenge. Basically, there are two criteria for magnetic component design, which are from thermic aspect or from the magnetic nature.
By JC Sun and K. Seitenbecher, Bs&T Frankfurt am Main GmbH
and Yi Dou, Technical University of Denmark
Power Supply
Gaining 2.5%+ in PFC Efficiency at Low Cost
For low-cost and simple implementation, power factor correction (PFC) has historically been achieved by simple diode bridge rectification and a single-switch boost converter. This arrangement however has significantly reduced efficiency at low line, requires bulky magnetics, large heatsink and fans with high airflow. ICERGi PFC solutions can offer 2.5%+ improvement in efficiency at a cost comparable with the conventional approach.
By Dr. Trong Tue Vu and Edgaras Mickus, Icergi Limited
Design and Simulation
What Makes a Good Magnetic Design?
The story of magnetics in Europe has many important characters including many who have been in the industry since the 80's. It is not possible to analyze what makes a good design without these people. I'm not referring to the researchers or the brilliant engineers, but rather the individuals who have been looking for the materials, winding the coils and repairing winding machines.
By Dr. Jose Molina, Frenetic
Power Management
Hybrid Converter Simplifies 48 V/54 V Step-Down Conversion in Data Centers and Telecom Systems
There has been a shift in data center and telecom power system design. Key applications manufacturers are replacing complex, expensive isolated 48 V/54 V step-down converters with more efficient, nonisolated, high density step-down regulators (Figure 1). Isolation is not necessary in the regulators' bus converter since the upstream 48 V or 54 V input is already isolated from hazardous ac mains.
By Ya Liu, Jian Li, San-Hwa Chee and Marvin Macairan, Analog Devices, Inc.
Magnetic Components
Thermal Endurance Estimation of Magnetic Components Used in Embedded Automotive Applications
Over the years, there has been considerable debate on how to determine and classify the thermal performance of insulation materials used in electrical power systems equipment and their related applications.
By Patrick Fouassier & Abdelkader Birch, Premo France Inductive Components R&D
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| Events |
India Electronics Week, Bangalore, India, February 13-15
indiaelectronicsweek.com
Embedded World, Nuremberg, Germany, February 25-27
embedded-world.de
Battery Electric Vehicle Architectures, Detroit, MI, USA, February 26-27
beva-detroit.com
Biricha's Digital Power Supply Design Workshop with TI, Garching, Germany, March 3-6
biricha.com/ti-dps
Power Analysis & Design Symposium, Eching, Germany, March 5
omicron-lab.com/training-events
Satellite, Washington, DC, USA, March 9-12
satshow.com
Biricha's Analog Power Supply Design Workshop with TI, Garching, Germany, March 10-13
biricha.com/aps
APEC, New Orleans, LA, USA, March 15-19
apec-conf.org
EMV, Cologne, Germany, March 17-19
mesago.de/en/EMV
AMPER, Brno, CZ, March 17-20
amper.cz
SEMICON China, Shanghai, China, March 18-20
semiconchina.org
electronica China, Shanghai, China, March 18-20
electronica-china.com
productronica China, Shanghai, China, March 18-20
productronica-china.com
CIPS, Berlin, Germany, March 24-26
cips.eu
CWIEME Shanghai, Shanghai, China, March 24-26
cn.coilwindingexpo.com
Battery Tech Expo, Silverstone, UK, March 26
batterytechexpo.co.uk
Power Electronics Expo, Silverstone, UK, March 26
powerelectronicsexpo.co.uk
Energy Storage Forum, Munich, Germany, March 30 - April 2
energystorageforum.com
IEEE CPE-POWERENG, Set·bal, Portugal, April 1-3
cpe-powereng2020.uninova.pt
ExpoElectronica, Moscow, Russia, April 14-16
expoelectronica.ru
Hannover Messe, Hannover, Germany, April 20-24
hannovermesse.de
PEMD, Nottingham, UK, April 21-23
theiet.org/pemd
The Battery Show Europe, Stuttgart, Germany, April 28-30
thebatteryshow.eu
EV Tech Expo Europe, Stuttgart, Germany, April 28-30
evtechexpo.eu
ETIP PV, Brussels, Belgium, May 5
etip-pv.eu
SMTconnect, Nuremberg, Germany, May 5-7
mesago.de/en/SMT
PCIM Europe, Nuremberg, Germany, May 5-7
mesago.de/en/PCIM
SCAPE, Stockholm, Sweden, May 10-12
ri.se/en/scape-2020
SEMICON Southeast Asia, Kuala Lumpur, Malaysia, May 12-14
semiconsea.org
ISPSD Conference, Vienna, Austria, May 17-21
ispsd2020.com
Thermal Management Innovation, San Jose, CA, USA, May 21
battery-thermal-management-usa.com
CWIEME Berlin, Berlin, Germany, May 26-28
coilwindingexpo.com/berlin
Workshop on Supercapacitors, Viterbo, Italy, May 27-28
supercap.org
ECCE Asia, Nanjing, China, May 31 - June 3
ipemc2020.com
BEVA Europe, Munich, Germany, June 5-6
beva-europe.com
EnerHarv, Raleigh, NC,áUSA, June 16-18
enerharv.com
ees Europe, Munich, Germany, June 16-19
ees-europe.com
Intersolar Europe, Munich, Germany, June 17-19
intersolar.de
Power2Drive, Munich, Germany, June 17-19
powertodrive.de
The Smarter E, Munich, Germany, June 17-19
thesmartere.de
3D Power Electronics Integration and Manufacturing, Osaka, JP, June 23-24
3d-peim.org
Sensor+Test, Nuremberg, Germany, June 23-25
sensor-test.de
Speedam, Sorrento, Italy, June 24-26
speedam.org
SPARK, London, UK, June 30 - July 1
spark.com
PCIM Asia, Shanghai, China, July 1-3
pcimasia-expo.com
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| New Products |
E Cores Solve Challenging Power Conversion Applications
Micrometals continues to expand their prototyping and custom core capabilities with the expansion of E Core variations available. Micrometals E Cores are renowned for their performance and quality by delivering exceptional part-to-part consistency. With over 20 industry standard E Core sizes, from 12.7mm to 210mm, in both Iron and Alloy materials, Micrometals leads the industry in COTS shapes and materials. One significant advantage to Micrometal's E Cores are their distributed gap materials, which do not require any gapping to improve saturation like ferrite cores.
micrometals.com/shapes/e-core
Intelligent Power Devices Enabling Standalone System Protection
ROHM announced the availability of the BV2Hx045EFU-C, a family of high voltage (41V) dual channel output high side switch (Intelligent Power Devices, IPD) optimized for automotive ECUs in transmission control, engine control, and other vehicle systems. IPDs are semiconductor devices that protect electronic circuits from breakdown (i.e. due to overcurrent during abnormalities). Unlike conventional fuses, IPD as semiconductor fuses can protect circuits without degrading or breaking down, making it possible to achieve maintenance-free systems.
View full press release
rohm.com/news
Low RDS(on) MOSFET
Nexperia announced the release of its lowest-ever RDS(on) power MOSFET. The PSMNR51-25YLH sets a new standard of 0.57 m? at 25 V. Utilising Nexperia's NextPowerS3 technology, this performance is offered without compromising other important parameters such as maximum drain current (ID(max)), Safe Operating Area (SOA) or gate charge QG. Very low RDS(on) devices are required in many applications such as ORing, hot-swap operation, synchronous rectification, motor control and battery protection, to reduce I²R losses and increase efficiency.
View full press release
nexperia.com/press-releases
AC/DC Modules Meet ecodesign Specifications
Dengrove Electronic Components is now stocking the RECOM RAC04-K/277 AC/DC 4-Watt power modules, which meet the latest EU ErP Lot 6 ecodesign specifications for standby and off-mode that apply to industrial and consumer products. Able to supply short-term overloads of up to 150%, the modules are a cost-effective solution for powering industry 4.0 and industrial automation, IoT and smart-building devices, and household appliances.
View full press release
dengrove.com/news
Source-Down 25 V Power MOSFET
Infineon Technologies is focusing on system innovation with enhancements on component level by addressing the challenges of modern power management designs. The Source Down is the new industry standard packaging concept. The first wave of power MOSFETs launched in this new package is the OptiMOS TM 25 V in a PQFN 3.3x3.3 mm.
View full press release
infineon.com/market-news
Jetting Solder Paste
Indium Corporation continues to develop innovative solder paste solutions to fit customers' needs. PicoShot NC-5M is designed for customers needing a no-clean halogen-free SAC305 solder paste for their Mycronic jetting systems or add-on and repair modules. PicoShot NC-5M jetting solder paste is the first material to come out of Indium Corporation's new partnership with Mycronic, a global leader in dispensing and jet printing equipment.
View full press release
indium.com/news
24V Industrial Power Supply
TDK Corporation announces the introduction of the TPS4000-24 power supply rated at up to 4,080W at 24V. The TPS series can operate automatically from 400, 440, and 480Vac nominal delta or WYE inputs, without wiring changes or the need for large, costly step-down transformers. This industrial grade power supply is ideal for use in a wide range of applications including test and measurement equipment, semiconductor fabrication, additive manufacturing, printers, laser cutting and RF power amplifiers.
View full press release
emea.lambda.tdk.com/news
Programmable DC Load Product Series
Vitrek introduces the DL Series of Digital, Programmable DC Loads, designed to support the testing requirements for the latest generation of off-line power supplies, dc-dc converters and LED drivers. The DL Series is also equipped to handle a wide range of battery testing requirements. The devices are offered in three power ratings (125W, 250W and 500W), each with input voltages of 0-150V or 0-500 VDC.
View full press release
vitrek.com/press
Fuses Designed for Automotive and In-Rush Current Applications
Bel Fuse-Circuit Protection announces their 0680L Series of ceramic surface mount fuses with in-rush current withstand capability in a 2410 SMD package size. These slow blow fuses are designed for automotive and applications which require high DC voltage ratings and high DC interrupting ratings. Bel's 0680L Series fuses are compatible with the 260º, IR Pb-free solder process and feature a current rating from 375mA to 12A and a wide operating temperature range of -55º to 125ºC.
View full press release
belfuse.com/news
Integrated Active Clamp Flyback Controllers
Silanna Semiconductor announced that its SZ1101 and SZ1105 fully integrated active clamp flyback (ACF) controllers for designing high-power-density AC/DC power adapters are now fully qualified and in production. The SZ1101 33W version is suited for designing mobile phone travel adapters, while the SZ1105 65W version is suited for designing compact adapters for powering notebooks, video game consoles, and multi-port wall chargers.
View full press release
silannasemi.com/pd-max-products
Wide Bandgap Power Amplifier
Mouser Electronics continues to push forward with new product introduction activity in the analogue space, by adding further Qorvo devices to its expansive portfolio. The 100-W QPA3069 power amplifier is predominantly focused on defence and avionics applications (such as radar). This high power density IC covers the 2.7-GHz to 3.5-GHz radio frequency (RF) band and offers a 25-dB power gain along with a 53% power-added efficiency (PAE).
mouser.com/pressroom
Relay with Power Contacts on NO and NC Side
More than 30 years ago, Panasonic changed the way how to design safety modules by bringing a low profile 8pole safety relay on the market. Now the launch of the new 1a1b SFM relay will start the next phase of the market revolution. With a height of only 7.8mm and reflow soldering capability, SFM provides great design possibilities and is ready for future production processes. As all Panasonic Industry safety relays, SFM offers power contacts on both NO (6A) and NC (4A) side to control loads like valves directly without another relay in between.
View full press release
industry.panasonic.eu
High Voltage Molded Power Inductors
Coilcraft has expanded its XEL Family of molded power inductors to include three higher-voltage series: the XEL401xV, XEL4020V and XEL4030V. All three offer operating voltage ratings of 120 V, 50% higher than the standard versions. They also offer exceptionally low DC resistance and ultra-low AC losses for greater power converter efficiency at high frequencies (2 to 5+ MHz) and high ripple current. XEL40xxV Family inductors measure just 4.0 x 4.0 mm with a maximum height of 3.2 mm and feature a rugged, composite construction that provides magnetic shielding and minimizes audible buzzing.
coilcraft.com
SMD Fuse Family Extended
The proven UMF 250 SMD fuse family is extended by a 15 A version. SCHURTER is now offering the UMF 250 in a total of 15 rated currents between 500 mA and 15 A. It is particularly suitable for electromobility applications with higher rated currents.With its quick characteristics (small melting integral) according to IEC 60127-4, the UMF 250 is the logical addition to the successful UMT 250 range. It is sealed against potting compound to achieve a hermetic seal for use in intrinsically safe applications according to ATEX and IECEx requirements.
View full press release
schurter.com/Newsroom
Quarter-Brick with Digital Control for Telecom and Compute Equipment
Artesyn Embedded Power announced the BDQ1300, a 1300 watt quarter-brick dc-dc converter, designed to provide the highest efficiency on-board 12V output for telecom, computing and server applications, with optional digital control. With efficiency rated over 97 percent, the BDQ1300 is designed as a voltage source for non-isolated point-of-load converters.
View full press release
advancedenergy.com
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InnoSwitch3-EP & TOPSwitch-JX: Two Multi-Output Solutions for Your Next Power Supply
